Multichip Hybrid Microelectronics Overview

Microelectronics Overview

We offer a wide range of proven production techniques and processes in the microelectronics and allied fields, supported by an innovative design team.

Some examples of our capabilities are listed below.

  • Hybrid design
  • Thick film hybrids
  • Mixed technology hybrids
  • Power electronics
  • Sensor electronics                                                                                                           
  • Microwave electronics
  • Chip on board
  • Opto-electronics
  • Sub-assembly
  • Electronic design
  • Software design
  • Product miniaturization
  • Obsolescence management
  • Improved reliability
  • Radiation hard

Our clients cross a variety of industries – Aerospace, Defense, Oil and Gas, Medical, Communications and Scientific Instrumentation, for both design and fabrication contracts. Our expertise and range of capabilities place Ultra Electronics among the leaders in the field of microelectronics engineering.

Product miniaturization and improved performance using Hybrids

Where the size of a product or system is largely determined by the size of its electronics, the potential for miniaturizing that product by using Hybrid technology instead of PCB technology is significant. Circuits that are largely digital in nature present the greatest potential for miniaturization; possibly to 10% of the size of the equivalent PCB without any reduction in function. Largely analogue circuits are less easily reduced in size with reductions of between 30% to 50% of the equivalent PCB. However, analogue circuits perform more efficiently as Hybrids providing additional benefits.

Hybrids are statistically more reliable than PCB assemblies as they typically contain no solder joints. Components are interconnected by welded joints (wire bonding) or silver loaded conductive epoxy adhesive, an extremely reliable and long established joint technology.

Hybrids can sustain higher operating temperatures than PCBs, with componentry available now that can function in 200°C indefinitely. The alumina or aluminium nitride substrates have a very high coefficient of thermal conductivity and junction-damaging “hot spots” beneath individual semiconductors are avoided by the swift transfer of heat away from that device.

Hybrids are hermetically sealed, either by way of sealed metal enclosure or conformal coating, making them the most suitable technology for electronics that operates in hostile environments.

 

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