Microelectronics Capabilities Specifications

Substrates

STANDARD 96% Alumina Thickness: 1 mm, 0.635 mm
POWER Aluminium Nitride Direct-bonded copper ceramic 20 x thermal conductivity increased current density
Max Print Size 150 mm x 100 mm

Printing

Conductors
Wire Bondable
Gold
4-7 mΩ/Square
Solderable
Palladium-Silver
20-30 mΩ/Square
Solderable Over Gold
Platinum-Gold
50-60 mΩ/Square
Standard Track/Gap
0.010″ ++width, 0.010″ spacing
Minimum Track/Gap
0.002″ width, 0.001″ spacing
Conductor Layers
6 Each Side
Through-Printed Holes
Gold
<20 mΩ Thru-hole
(Double Sided Printing
Palladium, Silver
<50 mΩ Thru-hole

 

Resistors
Range
<1 Ω To >50 MΩ
<10 Ω
+/-0.5 Ω
10 Ω To 100 Ω
+/-0.5%
100 Ω To 300 KΩ
+/-0.3%
> 300 KΩ
+/-0.5%
Stability
100 Ω to 1 MΩ
+/-0.5%
Absolute TCR Standard
+/- 100 ppm/°C
Absolute TCR Special
+/- 50 ppm/°C
Matching
Mid-Range Values
+/-0.1%
Power Dissipation
50 Watts/Square-Inch Nominal
Adjust On Test Facility
Active trim of circuit function (R or C)
Close Tolerance Resistors
Thin film chip resistors to 0.02% Absolute, 0.01% Matching

 

Assembly
CHIP AND WIRE
Transistors, FETs, Diodes Digital and analogue ICs Microprocessors and Memory Thin Film Resistors Inductors, Transformers, Crystals Capacitors, Ceramic, Tantalum or MOS
SOLDER SURFACE-MOUNT
All the above mounted as small-outline plastic packs, LCC or PLCC, D-packs (Power Devices) Chip Resistors

Wire Bonding

Gold
Thermosonic
0.0007mm ø to 0.002mm ø diameter
Aluminium
Ultrasonic
0.0007mm ø to 0.002mm ø diameter
Power Aluminium
Ultrasonic
0.005mm ø to 0.025mm ø diameter

Packages

Mil Spec Chip & Wire
Seam-sealed metal packs
Epoxy-sealed ceramic packs
Mil/Industrial
Silicone bond protected, Epoxy coated
Industrial & Commercial
Epoxy Coated
Surface-Mount
Epoxy Coated
Format
Dual-In-Line
Single-In-Line
Double Sided, Mixed Build
Customised Format (To suit application)

Electrical Test

Prototype Testing
Manual test or ATE
Production Testing
Bespoke PC controlled ATE system driving crates of dedicated equipment and IEEE controlled test equipment
Functional & Parametric testing at +22°C
To customers specifications
Hot & Cold Testing
T max and T min as specified, sample or 100%

Environmental Test

100% Group A screening tests

Fine & Gross Leak
<5 x 10⟩8 ATT CC/S
Acceleration (steady state)
5000 G
Rapid change of temperature
-65 °C To +150 °C, 5 Cycles
Burn-in
160 Hours at +125 °C, Powered

 

Group B screening tests – sample, monthly

Group C screening tests – sample, quarterly

Group D screening tests – sample, yearly