Microelectronics Wire Bonding

Wire bonding is the process of connecting the bare silicon die to the tracks on the ceramic substrate. This is achieved using automatic wire bonding machines using either gold or aluminium wire. The principle of the connection is one of ultrasonic welding. When the bond head is lowered, the wire is trapped between the head and either the substrate or the die. The bond head then oscillates at ultrasonic frequencies, scrubbing the two metals together and forming a weld. The bonders are capable of making a bond every half a second. The bonders are initially programmed for each circuit type with die and bond positions and then each circuit is adjusted automatically using visual pattern recognition software.

  • Gold or Aluminium wire
  • Wire diameters of down to 0.0007mm ø for fine-line and microwave
  • Wire diameters of up to 0.025mm ø for power devices
  • Gold tape bonding for microwave work

Wire bonding

Some examples include…
Gold Thermosonic, 0.0170 mm to 0.05 mm Ø
Aluminium Ultrasonic, 0.0170 mm to 0.05 mm Ø
Aluminium power Ultrasonic, 0.127 mm to 0.635 mm Ø